Next-gen LPDDR interface IP with ultra-low power leakage for AI and mobile workloads. UCIe-compliant PHY integration, enabling high-bandwidth chiplet connectivity for modular SoC architectures. Our 3nm solutions emphasize timing closure, IR/EM-aware layout, and power-aware floorplanning for maximum design efficiency.
Custom LPDDR PHY implementation optimized for low-latency memory access in AI/ML workloads. Support for multi-channel architectures, enabling high-throughput processing in datacenter and edge inference applications. We apply rigorous signal integrity analysis and advanced package-aware co-design techniques to meet the tightest performance specs.
Full-stack DDR/LPDDR controller and PHY integration, enabling memory subsystems for compute-intensive platforms. Cross-functional support spanning physical design, timing signoff, and memory calibration at both chip and system levels. We ensure silicon reliability and maximum bandwidth efficiency through thermal-aware routing and dynamic voltage management.
For customers targeting cost-sensitive or embedded markets, Makonis Semicon continues to deliver proven results at mature nodes: DDR/LPDDR memory interface solutions tailored for storage controllers and industrial-grade embedded devices. Power-optimized layout and timing closure techniques ensure consistent performance under harsh environmental conditions. Our deep familiarity with 12/16nm design flows allows us to strike the right balance between performance, cost, and reliability.
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